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    請使用永久網址來引用或連結此文件: https://irlib.pccu.edu.tw/handle/987654321/2809


    題名: A better technique using multisegment modeling and analysis of high-density and high-speed connectors
    作者: Kao CH
    Tseng CC
    Lee FM
    Lai MF
    貢獻者: 材料所
    關鍵詞: connectors
    digital visual interface (DVI)
    modeling
    multiply segmented and lumped coupled model
    near-end cross-talk (NEXT)
    peripheral component interconnection (PCI)
    express
    time-domain reflection (TDR)
    日期: 2006
    上傳時間: 2009-11-20 15:38:06 (UTC+8)
    摘要: A useful and rather new simulation technique for connectors up to 6.25 GHz is presented and discussed in this paper. The proposed model extracts electrical parameters of a connector using time-domain reflectometry (TDR) measurements. A new technique was developed to obtain accurate impedance profiles using TDR and a multisegment approach that is effectively a distributed coupled model. The parameter extraction and characterization of connectors are discussed. The performance of the proposed segmented transmission line model is verified by simulation of the model in SPICE and by experimental measurement. The results show that the proposed model can simulate the electrical characteristics, including crosstalk and impedance, of high-density and high-speed connectors with satisfactory accuracy. Based on the proposed modeling and CAD simulators, the design and analysis of complicated high-density and high-speed connectors can be executed accurately and effectively. Compared with other previous models, the proposed model can significantly improve the accuracy of simulation.
    關聯: IEEE TRANSACTIONS ON ADVANCED PACKAGING Volume: 29 Issue: 1 Pages: 140-148
    顯示於類別:[化學工程與材料工程學系暨碩士班] 期刊論文

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