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    請使用永久網址來引用或連結此文件: https://irlib.pccu.edu.tw/handle/987654321/2774


    題名: The improved electrical contact between a metal and porous silicon by deposition using a supercritical fluid
    作者: Lin JC;Tsai WC;Lee WS
    貢獻者: 材料所
    日期: 2006
    上傳時間: 2009-11-20 13:42:32 (UTC+8)
    摘要: In this study, the use of a CO2 supercritical fluid (SCF) and silver (Ag) nanoparticles is shown to improve the electrical contact between a metal and porous silicon (PS). Earlier problems concerning surface roughness are not observed. Scanning electron microscopy (SEM) showed that SCF processing at 100 degrees C with Ag nanoparticles of a diameter of about 100 nm filled the pores of PS. Separate experiments using different concentrations of the silver precursor in the process showed that the size and morphology of the nanoparticles could be controlled. Because of the large reduction in contact resistance that is produced, it is possible to observe a nonlinear current - voltage characteristic at room temperature.
    關聯: NANOTECHNOLOGY Volume: 17 Issue: 12 Pages: 2968-2971
    顯示於類別:[化學工程與材料工程學系暨碩士班] 期刊論文

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