薄膜電晶體(TFT)玻璃和彩色濾光片(C/F)玻璃以間隔粒(spacer)保持兩片玻璃的間隙並經熱壓合成母玻璃基板後，必須經過切割與裂片(scribe&break)的製程將母玻璃板斷裂成面板螢幕的尺寸，切割與裂片的製程的要件包括割輪的切割精度、速度和深度及斷裂條(breaker)施加的壓力及裁斷的精密度，同時在製程中要避免玻璃顆粒和切屑的產生及製程所產生靜電，本論文將進行TFT-LCD 母玻璃基板切割與裂片製程的有限元素分別分析，將割痕模擬為尖銳缺口與圓弧缺口，分析的參數包括元件數的多寡、割痕的深度、寬度、斷裂條的壓力及割痕、斷裂條對位之精密度、基板中間液晶填充之影響。此外，雷射切割技術應用於TFT-LCD母玻璃基板之裂片也將簡單探討。
本研究的目的是透過系統的有限元素數值分析了解這些參數對切割與裂片製程的影響，透過這些分析我們了解割痕之幾何模擬對有限元素分析之影響，同時獲得割痕之深度、寬度及壓力條對位之精密度對最大應力值及撓曲量之關係，我們也進行了簡單的雷射切割熱應力分析。此了解將能縮短傳統嘗試錯誤法(try and error)的時間，減少切割與裂片製程的失敗進而提升產品的良率。
The thin film transistor (TFT) glass and the color filter (C/F) glass are attached to form the mother glass with heat pressure and keeping the cell gap by the spacers. Subsequently, the mother glass is broken into the screen panel through the scribing and breaking process. The key engineering issues for the scribing and breaking process include the cutting precision, cutting speed and cutting depth of the cutting wheel and the applied pressure by the breaker as well as the breaking precision. In the same time, the process should avoid to produce glass particles and chipping and avoid electrical static deposition (ESD). The present paper will perform the finite element analysis (FEA) of scribing and breaking process for TFT-LCD. The model will investigate the parameters of the number of element, the cutting depth, width, the applied pressure and the aliment precision between the cutting groove and the breaker by simulating the cutting grave as a sharp north and an arch notch. In addition, technique of laser cutting on the scribing and breaking process will be briefly studied.
The objective of the present analysis is to understand the influences of those parameters on the scribing and breaking process through the systematic FEM numerical analysis. Through those analyses, the influence of modeling geometry and meshing number on FEM is investigated. The relationships between the cutting notch depth and width as well as the aliment precision and the largest stress and deflection are gained. This understanding can short the time to set up the parameters traditionally done by the try and error process such that preventing the process failure and elevating the product passing ratio.
