In this study, a commercially available process of electroless nickel plating with co-deposited diamond powders was applied to a steel substrate as an intermediate layer prior to diamond deposition by MPECVD. The diamond films show excellent adherence, since they are strongly bounded to the diamond particles, deeply anchored into the electroless plated nickel matrix. A synergism effect of electroless nickel plating and MPECVD diamond growth are discussed. The electroless nickel plate which can be hardened itself by the precipitated phosphide phases after the heat treatment is an efficient diffusion barrier against the inter-diffusion of iron from the steel substrate and carbon from CH4. A more continuous and smoother diamond film can be formed on the outermost surface. The results of tribotesting indicated that each step in the process of composite formation significantly lowers the friction coefficient (mu), especially the secondary layer of electroless nickel plate (similar to 1 mu m) is particularly effective and possesses a steadily low value of mu, which has promise for tribological applications. The secondary nickel layer could enhance the adherence of diamonds in the metal matrix, and be responsible for the better continuity of the top diamond film. (C) 2008 Elsevier B.V. All rights reserved.
關聯:
DIAMOND AND RELATED MATERIALS Volume: 17 Issue: 4-5 Special Issue: Sp. Iss. SI Pages: 853-859
