晶圓測試需要有微探針模組之探針卡做為測試機與焊墊間的接觸媒介，由於IC 設計的複雜性提高、焊墊空間縮小，探針針尖群形成一高密度的探針面，它的平整性對測試結果的正確性影響很大，也就是「共面度誤差」。共面度的控制是項很複雜的問題，探針製程會造成幾何尺寸變異，組裝公差的設定會影響探針針尖的最後位置，發展微細探針的非接觸量測與共面度評估系統為探針模組設計、製造、檢測上的重要課題。本研究擬應用三次元光學影像顯微鏡建構探針針尖影像量測系統，並發展以「最小平方法」、「最小區間法」之共面度評估程式。一般用於晶圓針測的探針直徑在75~125m之間，針尖與焊墊接觸面在 35m的直徑之內，依IC 設計在2020mm2面積上有2000~5000 組高密度分佈的探針群。為客觀的觀察探針面狀況，本研究提出應用「逆向曲面」理論建立探針模組之探針針尖虛擬曲面：藉由針尖群座標減化程序，決定建構曲面的控制點；然後依Bezier 理論，建構曲面模型；並分析探針曲面模型的曲面特性，可以得到較「最小平方法」、「最小區間法」更為精確的評估結果。本計畫的完成將可提供微探針模組製造與檢測的完整方案。
Wafer testing requires a probe card with micro-probe module as the contact media between the test machine and the welding pads. Due to the complexity in IC design and the narrow space of the welding pads, a high density probing surface is formed by the group of the needle tips. Flatness of the probing surface affects the probing correctness significant; that is the coplanarity error. Control of the coplanarity is a complicated problem. Forming of the probing needles will cause a variation of geometrical dimension. Setting of the assembly tolerance will affect the final positions of the needle tips. Therefore, developments of a non-contact measurement system and the coplanarity evaluation methodology are important issues in the fabrications of the micro-probe module. This study applies 3-D optical image microscope to catch the needle tips image to build a coplanarity measurement system by means of the least squares method and the minimum zone method. In general, the diameter of the probing needle is about 75~125m , and the contact area between needle tip and welding pad is under a diameter of 35m . There are 2000~5000 welding pads within a 2020mm2 square based on the IC design. In order to observe the conditions of the needle surface, this study proposes an original reverse surface methodology to construct the needle surface. Data reduction procedure is used to decide the surface control points, and then build the surface by Bezier model. The characteristics of the probing surface can be derived which having a more precise evaluation than the least squares method and the minimum method done. The accomplishment of this project can provide a whole solution in the manufacturing and the inspection for micro-probe module.
